{"id":12571,"date":"2008-01-01T00:00:00","date_gmt":"2008-01-01T08:00:00","guid":{"rendered":"https:\/\/www.hmc.edu\/clinic\/2008\/develop-validate-a-mathematical-model-of-a-wire-bonder-structure-for-use-in-the-development-of-future-platforms\/"},"modified":"2008-01-01T00:00:00","modified_gmt":"2008-01-01T08:00:00","slug":"develop-validate-a-mathematical-model-of-a-wire-bonder-structure-for-use-in-the-development-of-future-platforms","status":"publish","type":"post","link":"https:\/\/www.hmc.edu\/clinic\/2008\/develop-validate-a-mathematical-model-of-a-wire-bonder-structure-for-use-in-the-development-of-future-platforms\/","title":{"rendered":"Develop &#038; Validate a Mathematical Model of a Wire Bonder Structure for Use in the Development of Future Platforms"},"content":{"rendered":"<h2 class=\"project-sponsor-dept-year\"><span class=\"project-sponsor\">Orthodyne Electronics<\/span> <span class=\"project-dept-year\">Engineering, 2007-08<\/span><\/h2>\n<div class=\"project-team\">\n<p><strong>Liaison(s):<\/strong> Eric T. Scranton<br \/>\n<strong>Advisor(s):<\/strong> Samuel DiMaggio<br \/>\n<strong>Students(s):<\/strong> Rosemary Todd (TL),  Charles Clapper,  Austin Rutledge,  Vatche Attarian (S),  Max Myers (F)<\/p>\n<\/div>\n<div class=\"project-abstract\">\n<p>Orthodyne Electronics has commissioned the Harvey Mudd College Clinic team to develop a mathematical model of a 3600Plus wire bonder under motor-induced loads. During operation, a low frequency resonance limits machine performance, particularly at high accelerations. Noticeable vibrations caused by this resonance have caused concern among some customers. The model should be able to reproduce current machine responses and should be easily configurable so that it can be used to develop future bonder platforms.<\/p>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Orthodyne Electronics Engineering, 2007-08 Liaison(s): Eric T. Scranton Advisor(s): Samuel DiMaggio Students(s): Rosemary Todd (TL), Charles Clapper, Austin Rutledge, Vatche [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[164],"tags":[404],"class_list":["post-12571","post","type-post","status-publish","format-standard","hentry","category-engineering","tag-orthodyne-electronics"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/posts\/12571","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/comments?post=12571"}],"version-history":[{"count":0,"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/posts\/12571\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/media?parent=12571"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/categories?post=12571"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/tags?post=12571"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}