{"id":12534,"date":"2009-01-01T00:00:00","date_gmt":"2009-01-01T08:00:00","guid":{"rendered":"https:\/\/www.hmc.edu\/clinic\/2009\/modeling-the-viscoelastic-behavior-of-vibration-isolation-mounts-for-an-ultrasonic-wire-bonders\/"},"modified":"2009-01-01T00:00:00","modified_gmt":"2009-01-01T08:00:00","slug":"modeling-the-viscoelastic-behavior-of-vibration-isolation-mounts-for-an-ultrasonic-wire-bonders","status":"publish","type":"post","link":"https:\/\/www.hmc.edu\/clinic\/2009\/modeling-the-viscoelastic-behavior-of-vibration-isolation-mounts-for-an-ultrasonic-wire-bonders\/","title":{"rendered":"Modeling the Viscoelastic Behavior of Vibration Isolation Mounts for an Ultrasonic Wire Bonders"},"content":{"rendered":"<h2 class=\"project-sponsor-dept-year\"><span class=\"project-sponsor\">Orthodyne Electronics<\/span> <span class=\"project-dept-year\">Engineering, 2008-09<\/span><\/h2>\n<div class=\"project-team\">\n<p><strong>Liaison(s):<\/strong> Eric Scranton<br \/>\n<strong>Advisor(s):<\/strong> Philip Cha<br \/>\n<strong>Students(s):<\/strong> Jane Chen,  Nicolas Hasegawa (F),  Jackie Lam (S),  Thomas Oh (S),  Andrew Sabater (TL),  Brad Witkowski<\/p>\n<\/div>\n<div class=\"project-abstract\">\n<p>Develop mathematical models that can be used to characterize the viscoelastic isolation mounts on Orthodyne Electronics&#8217; 3600Plus ultrasonic wire bonder. The models are constructed using experimental force and displacement data, and they predict the transient settling behavior of the isolation mounts for a bandwidth limited set of forcing frequencies. Construct an experimental setup that represents a simplified version of the wire bonder. Validate the models by comparing the experimental transient displacement of the setup with the predicted response for each model.<\/p>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Orthodyne Electronics Engineering, 2008-09 Liaison(s): Eric Scranton Advisor(s): Philip Cha Students(s): Jane Chen, Nicolas Hasegawa (F), Jackie Lam (S), Thomas [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[164],"tags":[404],"class_list":["post-12534","post","type-post","status-publish","format-standard","hentry","category-engineering","tag-orthodyne-electronics"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/posts\/12534","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/comments?post=12534"}],"version-history":[{"count":0,"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/posts\/12534\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/media?parent=12534"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/categories?post=12534"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/tags?post=12534"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}