{"id":12495,"date":"2010-01-01T00:00:00","date_gmt":"2010-01-01T08:00:00","guid":{"rendered":"https:\/\/www.hmc.edu\/clinic\/2010\/modeling-damage-accumulation-in-solder-joints\/"},"modified":"2010-01-01T00:00:00","modified_gmt":"2010-01-01T08:00:00","slug":"modeling-damage-accumulation-in-solder-joints","status":"publish","type":"post","link":"https:\/\/www.hmc.edu\/clinic\/2010\/modeling-damage-accumulation-in-solder-joints\/","title":{"rendered":"Modeling Damage Accumulation in Solder Joints"},"content":{"rendered":"<h2 class=\"project-sponsor-dept-year\"><span class=\"project-sponsor\">Northrop Grumman Corporation<\/span> <span class=\"project-dept-year\">Engineering, 2009-10<\/span><\/h2>\n<div class=\"project-team\">\n<p><strong>Liaison(s):<\/strong> Todd Uramoto,  Bill Vanier,  Charles Volk<br \/>\n<strong>Advisor(s):<\/strong> Philip Cha<br \/>\n<strong>Students(s):<\/strong> Scott Almond (F),  Shawn Duenas (TL-S),  Nicolas Hasegawa,  Alex Krause,  Brendan Smith (S),  Lou Zellinger (TL-F)<\/p>\n<\/div>\n<div class=\"project-abstract\">\n<p>The goal of this project was to identify, test, and verify, a model to predict the number of times a particular circuit board can be subjected to its thermal cycling acceptance test before significant damage is accumulated in the form of crack initiation at the solder joints. A finite element analysis was employed to predict the time to crack initiation. Results from the model were compared to an experimental test in an environmental chamber using the aforementioned profile.<\/p>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Northrop Grumman Corporation Engineering, 2009-10 Liaison(s): Todd Uramoto, Bill Vanier, Charles Volk Advisor(s): Philip Cha Students(s): Scott Almond (F), Shawn [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[164],"tags":[265],"class_list":["post-12495","post","type-post","status-publish","format-standard","hentry","category-engineering","tag-northrop-grumman-corporation"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/posts\/12495","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/comments?post=12495"}],"version-history":[{"count":0,"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/posts\/12495\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/media?parent=12495"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/categories?post=12495"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.hmc.edu\/clinic\/wp-json\/wp\/v2\/tags?post=12495"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}