HMC
Engineering Internship Program (EIP)

The Department of Engineering is pleased to announce the third year of our program for engineering majors interested in industrial internship experiences.  The Engineering Internship Program (EIP) is designed to provide unique internship opportunities with the primary objective of contributing to their professional development of our students as engineers.


Below are the opportunities that are currently available. Applications are being accepted until April 5, 2013. Interviews will be arranged up through April 10, 2013, and application packages will be sent to the companies by April 11, 2013. 

To apply, please email a cover letter, resume and list of engineering major courses completed to EIP_Spring_2013@Sakai.claremont.edu, as well as notification to Sue Lindley that an application has been submitted. Applications will be reviewed by the Engineering Department , and students will be contacted to arrange for a brief interview with the Department Chair. There is a link to a sample application package as well for your reference.

 

Sample Application Package


FAQs

 

 

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Project - Airborne Media Server
Using Commercially Available Parts and Linux OS

Project - Scalable Compute Farm for Massively Parallel Monte-Carlo Simulations

Customer Interaction Modeling
and Analysis
Exede Internet Service Installation
Assistance Application

 

 

 

 

Standardize Web Server Look and Feel for Multi-Waveform Modems 

Throughput and Scheduler Test Tool



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Summer Intern