HMC
Engineering Internship Program (EIP)

The Department of Engineering is pleased to announce the third year of our program for engineering majors interested in industrial internship experiences.  The Engineering Internship Program (EIP) is designed to provide unique internship opportunities with the primary objective of contributing to their professional development of our students as engineers.


Below are some of the companies we expect to have opportunities from throughout the year. As they become available, an email will be sent out to our majors with deadlines for applications.

To apply, please email a cover letter, resume and list of engineering major courses completed to EIP_1011@Sakai.claremont.edu, as well as notification to Sue Lindley that an application has been submitted. Applications will be reviewed by the Engineering Department , and students will be contacted to arrange for a brief interview with the Department Chair. There is a link to a sample application package as well for your reference.

 

Sample Application Package


FAQs

US Army Corps of Eng Aerospace Spacex

Filled

Opportunities May Be Available Again in the Future

Opportunities Currently Available
Apply by February 1, 2011
ViaSat

ViaSat picture


Opportunities Currently Available

New Opportunities Now Available

Apply by February 28, 2011